Experience : 8+ YearsLocation : Assam, Jagiroad1) Experience in semiconductor packaging quality area in an OSAT environment.2) Strong Knowledge of wire bonding, flip chip, and ISP technologies.3) Proficiency in Minitab, JMP, and other statistical analysis tools.4) Excellet problem-solving, documentation, and communication skills5) Experience with QFN, BGA, WLCSP, and other advanced package types.6) Familiarity with thermal modeling, substrate design, and mechanical stress analysis.7) Knowledge of cleanroom protocols, ESD handling, and reliability standards.