Skill - Advanced package Design (APD)Location- BangaloreExperience - 5+yearsJDGood hands-on experience in IC Package Substrate design and Interposer DesignFamiliarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)Good knowledge of substrate structure, design rules and material propertyExperience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalentExperience of Synopsys 3D IC compiler and ICC2 is added advantageDesign experience with MCM/SiP packages, module schematic and layout design experienceKnowledge of Complex, High-Speed PCB, and IC PackagingUnderstanding/ experience in scripting – Perl/ SKILL programmingUnderstanding of DRC and DFM (Design For Manufacturing)Understanding in SI/PI tools, package model extraction, S-parameter